A significant aspect of Apple’s A-series and M-series chips is their System-on-a-Chip (SoC) architecture, which combines all essential components within a single unit, encompassing both the CPU and GPU.
However, a recent report indicates that the M5 Pro chip might pursue a novel strategy, opting for a more distinct separation between the CPU and GPU to enhance performance and increase production efficiency…
System-on-a-Chip Strategy
Historically, traditional computing systems utilized entirely standalone CPU (central processing unit) and GPU (graphics processing unit), frequently situated on separate circuit boards.
With the introduction of the iPhone, Apple revolutionized this model by integrating both components into a single System-on-a-Chip (SoC). This integration combines what would traditionally be distinct chips into one compact unit, embedding circuitry for both functions. Apple later applied this design principle in devices powered by its M-series chips for Apple Silicon Macs.
The classification of this technology as a single chip versus a compact assembly of several chips often hinges on semantic interpretation, although Apple labels its offerings as singular chips, such as the A18 Pro and M4 chips.
M5 Pro Chip Featuring Separate CPU and GPU
According to analyst Ming-Chi Kuo, the M5 Pro chip will leverage TSMC’s latest chip packaging technology, known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal).
This SoIC-mH method enhances thermal efficiency by integrating various chips into a single package, thereby allowing the processor to maintain peak performance for extended periods before thermal throttling is required. This process is expected to increase production yields as well, with a reduced failure rate in quality control checks.
Kuo’s insights suggest that this methodology will be implemented in the M5 Pro, Max, and Ultra variations of the forthcoming M5 chip.
The M5 series chips will adopt TSMC’s cutting-edge N3P node, which recently transitioned to prototype development. Mass production for the M5, M5 Pro/Max, and M5 Ultra is anticipated in the first half of 2025, the second half of 2025, and in 2026, respectively.
The M5 Pro, Max, and Ultra models will utilize server-grade SoIC packaging, employing 2.5D packaging technology named SoIC-mH to enhance both production yields and thermal management, featuring distinct designs for CPU and GPU.
Interestingly, previous reports indicated that the iPhone 18 would also begin to separate various components of the A-series chip, specifically signaling a divide for RAM, which is currently integrated within the chip.
Usage in Apple Intelligence Servers
Kuo also mentioned that M5 Pro chips are set to play a role in Apple Intelligence servers, referred to as Private Cloud Compute (PCC).
Apple’s infrastructure development for PCC will expedite following the mass production of high-performance M5 chips, which are particularly suited for AI inferencing tasks.
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